Design and Applications of Integrated Transducers in Commercial CMOS Technology

Monolithic integration of Microelectromechanical Systems (MEMS) directly within CMOS technology offers enhanced functionality for integrated circuits (IC) and the potential improvement system-level performance MEMS devices in close proximity to biasing sense circuits. While bulk CMOS-MEMS solutions involve post-processing chips define freely-suspended structures, there are key applications conditions under which a solid, unreleased acoustic structure composed stack is preferred. Unreleased benefit from lower barrier-to-entry with no chip, simplified packaging, robustness acceleration shock, stress gradient insensitivity, opportunities frequency scaling. This paper provides review advances over past decade, focus on dispersion engineering guided waves CMOS, confinement, transducers, large signal modeling. We discuss limits standard capacitive transduction, emphasis boost emerging materials including ferroelectrics development memory.